Will Future CPUs be Flexible?
Filed in archive Tech News Around The World by Shane McGlaun on July 24, 2006
Engineers at the University of Wisconsin-Madison have developed a method of isolating single crystal film of semiconductor from the substrate which it is built. After extracting the semiconductor they transferred it to a very thin film, which can host active components on each side. This discovery may lead the way to 3-D computer chips that could revolutionize consumer electronics.
According to ZDNet the technology can also be used for a number other purposes as well including solar cells, smartcards, RFID tags, and even active-matrix flat-panel
LCD displays. A super thin, flexible LCD display would be a very welcome computer component. ZDNet goes on to say that will be a while before this new technology is adopted as the semiconductor and she has billions invested in its factories, and it will take time for any change to be made. In other words, it could be years before we see any technology on the market using this process.
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